Premium 830 Tie Point Solderless Breadboard with 3 Binding Posts, Metal Backplate (7.2" x 3.8") each capable of 250mA

each capable of 250mA

Package Contents:

The test leads accept optional accessories such as clips and specialty probes

Built-in COMPONENT TESTER

prototyping and experimentation

Premium 830 Tie Point Solderless Breadboard with 3 Binding Posts, Metal Backplate (7.2" x 3.8") each capable of 250mASolderless breadboard ideal for testing, prototyping and experimentation Contact Points: 830 630 in a 63 x 10 matrix terminal strip 200 in 2 power rails Binding Posts: 3 Features a sturdy aluminum backing, rubber feet with peel to reveal adhesive are included Printed legend indicates columns and rows with numbers and letters, distribution strips are color coded and indicated + and Overall Size: 7. 2" x 3. 8" This solderless breadboard is ideal for